1、Material: Aluminum alloy material can reduce the temperature of for Orange Pi in use to a certain extent, and the heat dissipation function is more efficient. 2、With Silicone Pad: Comes with thermal conductive silicone for efficient heat dissipation. 3、Heat Dissipation Groove: The upper cover of the casing is designed with a heat dissipation groove, which increases the heat dissipation surface area and better protects the motherboard (excluding for Orange Pi motherboard!). 4、Simple Black: The simple black design fits perfectly with the interface of the corresponding motherboard. 5、Easy To Install: Reserve the hole for the antenna, the opening is accurate, one to one correspondence, and completely fit the development board, which is easy to install.