Features 1、[Applicable Model] This CPU BGA reballing stencil is suitable for Samsung S8 S8+ NOTE8 series mobile phone repair and maintenance. 2、[Anti Sticking] Multiple IC slots are set on the steel body by semi etching process, effectively preventing small IC from sticking tin and protecting small IC from breaking corners. 3、[Precise Positioning] The tin planting template can accurately locate and provide fast and efficient tin planting. 4、[High Temperature Resistance] The reballing stencil will not deform under high temperature, you can use with confidence. 5、[Easy Carrying] Compact appearance makes the reball template easy to carry and use, stainless steel material ensures long service life. Specification Item Type: BGA Reballing Stencil Material: Stainless Steel Spacing: 0.12mm Applicable Model: For Samsung S8 S8+ NOTE8 series Package List 1 x BGA Reballing Stencil